中文 | English
Home Product Quality Assurance Company Tour Capability Manufacture Service RFQ Contact Us
Profile
Quality Assurance
Quality Control
Company Tour
Capability
Manufacture Service
Capability Home >> Capability

Process item

Spec description

Capability of manufacturing

Matterial

FR-4 Tg 130/150/170/180

Yes

CEM-1/CEM-3

Yes

Halogen-Free

Yes

Aluminum laminate

Yes

Board Size

Max. Panel Size

20 × 24

Min. Panel Size

8 × 8

Max. Board Thickness

3.2mm

Min. Board Thickness

0.25mm

Inner layer

Min. Line Width / Space

4/4 mil

Min. Copper Thickness

H/ Hoz

Max Copper Thickness

3/3 oz

Min. Core Thickness

8mi

Line Width Tolerance

+/- 20%

Lamination

Layer Count

12 Layers

Min Dielectric Tolerance

+/-10%

Board Thickness Tolerance

+/-10%

Drilling

Min. Mechanical Drill Size

0.15mm

Max. Mechanical Drill Size

6.35mm

Hole to Hole location Tol

+/-3 mil

NPTH Hole Diameter

+/- 2mil

PTH Hole Diameter Tol

+/- 3mil

Plating

Aspect Ratio

( Board thickness to Hole size)

8:1

Cu Thickness in Hole

≧8mil (IPC)

All Laminate

Yes

Panel Plating

Yes

Process item

Spec description

Capability of manufacturing

Outer layer

Line Width/ Space

4/4 mil

Max. Copper Thickness

5oz

Line Width/space Tolerance

+/- 20%

Registration Tolerance

+/- 3 mil

Solder mask

S/M Thickness over trace

≧4mil (IPC)

S/M Registration Tolerance

+/- 3 mil

Via Plugging

Yes

Min Solder Dam Width

4 mil

S/M Registration Tolerance

+/- 3 mil

Impedance

Impedance Control Tol.

+/-10%

Surface finished

HASL Thickness

40~1000 μ

Immersion Tin

20-40μ

Immersion Silver

4~12 μ

OSP Thickness

0.25-0.5um

Flash Gold thickness

0.5—6u

Immersion Gold

2-6u

Plated Nickel

≧100U

Electrics test

Smallest SMT width

10mil

Smallest BGA width

10mil

Smallest BGA pitch

12mil

outline

Punching Tol

+/-4mil

Routing Tol

+/-5mil

V-Scoring

V-knife Angle °

20°/30°/

45/°60°

Registration TOL< Up and Low>

+/-0.10mm

Gold finger Chamfer <Bevel angle>

Yes


Process item

Spec description

Capability of manufacturing

Base Material

Polyimide

Yes

Polyester

Yes

Insulation layer

Min Thickness

12um

Max Thickness < used>

50um

Copper Foil

Rolled Anneal Copper foil

Yes

Electrolysis Disposition Copper foil

Yes

Pure Copper Foil

Yes

Min Thickness

1/3OZ

Max Thickness

2 OZ

Board Size

Max. Panel Size

9.8 × 19.68

Min. Panel Size

8 × 8

Min. Board Thickness

50um

Inner layer

Min. Line Width / Space

2/2 mil

Min. Copper Thickness

1/3oz

Max Copper Thickness<used>

1/1oz

Line Width Tolerance

+/- 20%

Lamination

Layer Counts

6 Layer

Board Thickness Tolerance

+/-03mm

Drilling

Min. Mechanical Drill Size

0.15mm

Registration Tol

<D/F Circuit Pattern>

+/-3 mil

<Cover layer or S/M >

+/-3 mil

<Stiffener Sticking>

+/- 5mil

Process item

Spec description

Capability of manufacturing

Plating

Cu Thickness Type 2

10um Min--IPC

Cu Thickness Type 3/4

20um Min--IPC

PTH Hole Tolerance

+/-3mil

NPTH Hole Tolerance

+/-3mil

Outer layer

Min Line Width/ Space

2/2 mil

Max. Copper Thickness

2oz

Line Width/space Tolerance

+/- 20%

Cover layer

<Solder mask>

S/M +Coverlayer mixture

Yes

Solder mask/CVL dam

4mil

Solder mask Thickness

IPC 10um min

Outline

Laser Cutting

+/-4mil

Punching Tol

+/-4mil

Surface finished

Immersion Tin

20-40μ

Immersion Silver

4~12 μ

OSP Thickness

0.25-0.5um

Flash Gold thickness

0.5—6u

Immersion Gold

1-6u

Nickel Thickness

100—200u

Electrics test

Smallest SMT width

10mil

Smallest BGA width

10mil

Smallest BGA pitch

12mil





TEL:0086-755-32936189   FAX:0086-755-23088560 Copyright (C) Wincor Industries Limited..All rights reserved